Multi-Chip Die Bonding by Datacon With its latest Multi-Chip Die Bonding, the 2200 apm+, Datacon meets the newest challenges of many users. The industry proven platform concept and the superior flexibility of the 2200 apm are now available on the 2200 apm+, with the added capability of handling wafers up to 300 mm and die up to 50 mm.
The 2200 apm Multi Chip Die Bonding is the current industry standard based on Datacon's previous PPS 2200 Multi Chip Die Bonding platform, a revolutionary modular system introduced in 1995.The Datacon 2200 apm provides users with extraordinary flexibility with minimum space requirements. Whatever connection technologies you choose (flip chip, die attach, or a combination of both) the conversion between different applications is done fast and simply. The 2200 apm was developed specifically for the demanding advanced packaging market. Die Bonding Technology by die-bonding.net |
